Micron: Taiwan, China's industrial chain helps mass produce HBM3E chips
Mar 25,2024
Micron recently announced the successful mass production of the latest generation HBM high bandwidth storage product HBM3E, and will supply Nvidia H200 GPU this year. The executives of Micron said that the support of Taiwan, China's supply chain is indispensable.
With the development of artificial intelligence (AI), the market demand for HBM chips has increased significantly, and the industry is actively promoting technological progress and capacity improvement. Praveen Vaidyanathan, vice president of Micron Technology and general manager of the Computing Products Business Unit, said that the support of Taiwan, China's supply chain partners was one of the reasons Micron realized the mass production of HBM3E in advance. From the product design stage, Micron has worked closely with its supply chain partners. Partners in Taiwan, China, China, include IP providers, whose technology helps speed up the interconnection between HBM and GPU.
In addition, TSMC has provided assistance in advanced packaging processes, as both Micron and TSMC are members of the 3D Fabric Alliance and have been collaborating since the initial stages of development.
According to research firm KED Global, Micron's DRAM market share in the fourth quarter of 2023 was 20%, and it is expected that Micron's share in the HBM market will be comparable to DRAM by 2025.
It is reported that Meiguang's 8-layer stacked 24GB HBM3E product has started mass production in February 2024, and the 12 layer stacked 36GB HBM3E product has also started sampling.
With the development of artificial intelligence (AI), the market demand for HBM chips has increased significantly, and the industry is actively promoting technological progress and capacity improvement. Praveen Vaidyanathan, vice president of Micron Technology and general manager of the Computing Products Business Unit, said that the support of Taiwan, China's supply chain partners was one of the reasons Micron realized the mass production of HBM3E in advance. From the product design stage, Micron has worked closely with its supply chain partners. Partners in Taiwan, China, China, include IP providers, whose technology helps speed up the interconnection between HBM and GPU.
In addition, TSMC has provided assistance in advanced packaging processes, as both Micron and TSMC are members of the 3D Fabric Alliance and have been collaborating since the initial stages of development.
According to research firm KED Global, Micron's DRAM market share in the fourth quarter of 2023 was 20%, and it is expected that Micron's share in the HBM market will be comparable to DRAM by 2025.
It is reported that Meiguang's 8-layer stacked 24GB HBM3E product has started mass production in February 2024, and the 12 layer stacked 36GB HBM3E product has also started sampling.