MediaTek and REDMI collaborate to launch Turbo 4 with Dimensity 8400 Ultra chip
Jan 03,2025
On the afternoon of January 2nd, the REDMI Turbo 4 smartphone was officially released, which is the world's first to be equipped with the MediaTek Dimensity 8400 Ultra flagship chip. It has both flagship performance and super energy efficiency!
REDMI、 MediaTek and Arm have reached a cooperation agreement to launch the customized Dimensity 8400 Ultra flagship platform, upgrade the full core architecture, and reshape the mid to high end performance landscape with ultra-high energy efficiency.
Through strong cooperation among three parties, REDMI Turbo 4 smartphone and Dimensity 8400 chip will change consumers' expectations for lightweight flagship smartphones. The popularization of full core architecture will enable more users to enjoy high-performance and low-power smartphone experiences.
With the deepening development of technologies such as generative AI and 5G, the global smartphone market presents a new round of development momentum, driving continuous technological architecture and upgrading of mobile phone chips. The Dimensity 8400 not only adopts a full core architecture for the first time, but also has a CPU GPU、NPU、 A series of software and hardware innovations and upgrades have been carried out in areas such as imaging and communication, making it the most "willing" lightweight flagship platform in MediaTek's history.
REDMI、 MediaTek and Arm have reached a cooperation agreement to launch the customized Dimensity 8400 Ultra flagship platform, upgrade the full core architecture, and reshape the mid to high end performance landscape with ultra-high energy efficiency.
Through strong cooperation among three parties, REDMI Turbo 4 smartphone and Dimensity 8400 chip will change consumers' expectations for lightweight flagship smartphones. The popularization of full core architecture will enable more users to enjoy high-performance and low-power smartphone experiences.
With the deepening development of technologies such as generative AI and 5G, the global smartphone market presents a new round of development momentum, driving continuous technological architecture and upgrading of mobile phone chips. The Dimensity 8400 not only adopts a full core architecture for the first time, but also has a CPU GPU、NPU、 A series of software and hardware innovations and upgrades have been carried out in areas such as imaging and communication, making it the most "willing" lightweight flagship platform in MediaTek's history.
It is reported that the Dimensity 8400 Ultra chip is positioned as a "full core energy efficiency chip" and can be regarded as an unprecedented huge upgrade of the Dimensity 8 series. The Dimensity 8400 Ultra used in the REDMI Turbo 4 phone is built using a 4nm process and adopts a full core architecture for the first time. The new generation of energy-efficient large core Arm A725 is launched, which adopts flagship L2/L3/SLC ultra large cache, as well as flagship same generation GPU, NPU, ISP architecture. It has been tested to play mainstream games and overloaded games at full frame rate, and the daily top 10 high-frequency usage scenarios are long-lasting and smooth.
Specifically, the full core CPU of the Dimensity 8400 Ultra chip includes 8 Arm Cortex-A725 cores with a maximum clock frequency of up to 3.25GHz. It adopts an architecture design of "1 * 3.25GHz+3 * 3.0GHz+4 * 2.1GHz", which improves CPU single core performance by 10% and reduces power consumption by 35% compared to the previous generation; The multi-core performance of the CPU has been significantly improved by 41%, and with precise energy efficiency control technology, multi-core power consumption has been reduced by 44% compared to the previous generation. It is suitable for various daily use scenarios, including gaming, music playback, video recording, and social interaction, providing users with a more durable and reliable device experience.
The Dimensity 8400 chip is equipped with the flagship Mali-G720 MC7 GPU of the same class, which improves GPU peak performance by 24% compared to the previous generation chip and reduces power consumption by 42%. This GPU supports hardware ray tracing and optimizes touch latency, which will bring users a richer and more immersive visual experience. It can easily cope with complex game scenes and high frame rate requirements, further improving graphics processing effects.
In addition to core components such as the Dimensity 8400 chip, the REDMI Turbo 4 phone is also equipped with a 3D ice sealed circulating cold pump, a 1.5K highlight screen, a 6550mAh Xiaomi Jinshajiang battery, an upgraded dual boost cold resistant chip, a 2.5D micro arc frame, a frosted soft fog glass back cover, IP68 dust and water resistance, and other new features on its hardware.
Specifically, the full core CPU of the Dimensity 8400 Ultra chip includes 8 Arm Cortex-A725 cores with a maximum clock frequency of up to 3.25GHz. It adopts an architecture design of "1 * 3.25GHz+3 * 3.0GHz+4 * 2.1GHz", which improves CPU single core performance by 10% and reduces power consumption by 35% compared to the previous generation; The multi-core performance of the CPU has been significantly improved by 41%, and with precise energy efficiency control technology, multi-core power consumption has been reduced by 44% compared to the previous generation. It is suitable for various daily use scenarios, including gaming, music playback, video recording, and social interaction, providing users with a more durable and reliable device experience.
The Dimensity 8400 chip is equipped with the flagship Mali-G720 MC7 GPU of the same class, which improves GPU peak performance by 24% compared to the previous generation chip and reduces power consumption by 42%. This GPU supports hardware ray tracing and optimizes touch latency, which will bring users a richer and more immersive visual experience. It can easily cope with complex game scenes and high frame rate requirements, further improving graphics processing effects.
In addition to core components such as the Dimensity 8400 chip, the REDMI Turbo 4 phone is also equipped with a 3D ice sealed circulating cold pump, a 1.5K highlight screen, a 6550mAh Xiaomi Jinshajiang battery, an upgraded dual boost cold resistant chip, a 2.5D micro arc frame, a frosted soft fog glass back cover, IP68 dust and water resistance, and other new features on its hardware.