Infineon Launches 650 V EasyPACK™ CoolGaN™ Module to Meet Growing Global Power Demands

As global energy consumption surges—driven by the rapid expansion of AI data centers, widespread adoption of electric vehicles, and the ongoing wave of digitalization and re-industrialization—Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is addressing the challenge with the release of its new EasyPACK™ CoolGaN™ 650 V power module. Expanding its GaN power portfolio, this latest innovation is built on the proven Easy Power Module platform and is designed for high-power applications such as data centers, renewable energy systems, and DC electric vehicle (EV) charging stations.

This module combines high performance with simplified integration, enabling designers to accelerate development and bring products to market faster—all while meeting the increasingly demanding performance requirements of next-generation power systems.

Roland Ott, Senior Vice President and head of Infineon’s Green Energy Modules and Systems division, noted:
"The EasyPACK power module based on CoolGaN leverages Infineon’s extensive expertise in both power semiconductors and modular packaging. This synergy delivers a highly efficient and scalable solution that meets the evolving performance and energy efficiency needs of data centers, renewable power, and EV charging applications."

Compact Design for High-Efficiency Power Delivery
The EasyPACK CoolGaN module incorporates 650 V CoolGaN power transistors and features a compact layout optimized for low parasitic inductance, enabling fast, efficient switching. Each module is capable of delivering up to 70 kW per phase, supporting compact and scalable high-power architectures.

Enhanced Thermal Performance and Reliability
By integrating Infineon’s .XT interconnect technology with the CoolGaN platform, the module achieves enhanced thermal management and long-term reliability. The .XT technology utilizes a high-performance substrate that significantly reduces thermal resistance, improving overall system efficiency while reducing cooling requirements. These enhancements translate to higher power density and superior cycling robustness, even under demanding operating conditions.

Versatility for Broad Application Requirements
The EasyPACK CoolGaN module supports multiple topologies and customization options, offering the flexibility needed for a wide range of industrial and energy-sector applications. This makes it a highly versatile solution for customers developing advanced power systems in an evolving energy landscape.