Sony launches the lowest power consumption IoT composite chipset
Nov 25,2022
According to EENews, Sony Semiconductor Israel has introduced a chipset for large-scale Internet of Things networks with 5G, satellite and LPWAN connections, which is said to have the lowest power consumption.
ALT1350 is the first chipset in the world that combines cellular LTE-M/NB IoT with sub GHz Low Power Wide Area Network (LPWAN) communication protocol, satellite connectivity (NTN) and sensor hub supporting AI.
Compared with the current generation, the standby mode (eDRX) power consumption in the chipset is reduced by 80%, and the power consumption when sending short messages is reduced by 85%. Comprehensive improvements in system power management have increased the battery life of typical devices by four times, allowing more functionality with smaller batteries.
The iSIM based chipset supports the mature Release 15 LTE-M/NB IoT software stack and will be compatible with 3GPP Release 17 in the future to ensure the service life and operation of the 5G network.
The sub GHz and 2.4GHz integrated transceivers support hybrid connections of smart meters, smart cities, trackers and other devices. It supports IEEE 802.15.4 based protocols, such as Wi Sun, U-Bus Air and wM Bus, as well as other point-to-point and mesh technologies. It supports IPv4/IPv6 Internet protocols, including TCP/UDP, PPP, FTP, HTTP, TLS, HTTPS and SSL, as well as DTSL, MQTT, CoAP and LWM2M.
The ALT1350 also integrates a sensor hub based on the ARM Cortex-M0+core to collect data from sensors while maintaining ultra-low power consumption. It also provides cellular and Wi Fi based positioning, and is tightly integrated to provide power optimized concurrent LTE and GNSS to adapt to various demanding tracking applications through a single chip.
The chipset uses ARM Cortex-M4 integrated controller with 1MB NVRAM and 752KB RAM to run IoT applications, thus providing edge processing functions, including data collection and low-power AI/ML processing of data.
The ALT1350 also includes security components for application use and an integrated SIM (iSIM) designed specifically for PP-0117 to meet GSMA requirements.
"The market demand for this multi protocol, ultra-low power IoT chipset is growing, and Sony's ALT1350 chipset meets this demand," said Nohik Semel, CEO of Sony Semiconductor Israel. "This is the game rule changer we have been waiting for. It will support the deployment of the Internet of Things and make use of the universal connection of edge processing and multi location technology."
The chipset adopts a single package. Although Sony does not specify a size, it is providing samples to major customers and will be available in 2023.
ALT1350 is the first chipset in the world that combines cellular LTE-M/NB IoT with sub GHz Low Power Wide Area Network (LPWAN) communication protocol, satellite connectivity (NTN) and sensor hub supporting AI.
Compared with the current generation, the standby mode (eDRX) power consumption in the chipset is reduced by 80%, and the power consumption when sending short messages is reduced by 85%. Comprehensive improvements in system power management have increased the battery life of typical devices by four times, allowing more functionality with smaller batteries.
The iSIM based chipset supports the mature Release 15 LTE-M/NB IoT software stack and will be compatible with 3GPP Release 17 in the future to ensure the service life and operation of the 5G network.
The sub GHz and 2.4GHz integrated transceivers support hybrid connections of smart meters, smart cities, trackers and other devices. It supports IEEE 802.15.4 based protocols, such as Wi Sun, U-Bus Air and wM Bus, as well as other point-to-point and mesh technologies. It supports IPv4/IPv6 Internet protocols, including TCP/UDP, PPP, FTP, HTTP, TLS, HTTPS and SSL, as well as DTSL, MQTT, CoAP and LWM2M.
The ALT1350 also integrates a sensor hub based on the ARM Cortex-M0+core to collect data from sensors while maintaining ultra-low power consumption. It also provides cellular and Wi Fi based positioning, and is tightly integrated to provide power optimized concurrent LTE and GNSS to adapt to various demanding tracking applications through a single chip.
The chipset uses ARM Cortex-M4 integrated controller with 1MB NVRAM and 752KB RAM to run IoT applications, thus providing edge processing functions, including data collection and low-power AI/ML processing of data.
The ALT1350 also includes security components for application use and an integrated SIM (iSIM) designed specifically for PP-0117 to meet GSMA requirements.
"The market demand for this multi protocol, ultra-low power IoT chipset is growing, and Sony's ALT1350 chipset meets this demand," said Nohik Semel, CEO of Sony Semiconductor Israel. "This is the game rule changer we have been waiting for. It will support the deployment of the Internet of Things and make use of the universal connection of edge processing and multi location technology."
The chipset adopts a single package. Although Sony does not specify a size, it is providing samples to major customers and will be available in 2023.