|
|
• Standard 126-type pinout
|
| • 5Ω switch connection between two ports |
| • Rail-to-rail switching on data I/O ports |
• Ioff supports partial-power-down mode operation
|
• Latch-up performance exceeds 100mA per JESD 78, Class II
|
|
| CATALOG |
SN74CBTLV3126PWR COUNTRY OF ORIGIN
|
SN74CBTLV3126PWR PARAMETRIC INFO
|
SN74CBTLV3126PWR PACKAGE INFO
|
SN74CBTLV3126PWR MANUFACTURING INFO
|
SN74CBTLV3126PWR PACKAGING INFO
|
SN74CBTLV3126PWR ECAD MODELS
|
SN74CBTLV3126PWR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
| Germany |
| Taiwan (Province of China) |
| China |
| Malaysia |
|
PARAMETRIC INFO
|
| Logic Function |
Bus Switch |
| Number of Elements per Chip |
4 |
| Number of Inputs per Chip |
4 |
| Number of Outputs per Chip |
4 |
| Configuration |
1 x 1:1 |
| Logic Family |
CBTLV |
| Process Technology |
0.6um |
| Maximum On Resistance (Ohm) |
27(Typ) |
| Minimum Operating Supply Voltage (V) |
2.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
0.25@3.3V |
| Absolute Propagation Delay Time (ns) |
4.8 |
| Propagation Delay Test Condition (pF) |
50 |
| Maximum High Level Output Current (mA) |
-128 |
| Maximum Low Level Output Current (mA) |
128 |
| Maximum Quiescent Current (uA) |
10 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
Gull-wing |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
6.4 |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.24 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H (mm) |
1.05 |
| Minimum PACKAGE_DIMENSION_H (mm) |
N/A |
| Maximum PACKAGE_DIMENSION_L (mm) |
5.1 |
| Minimum PACKAGE_DIMENSION_L (mm) |
4.9 |
| Maximum PACKAGE_DIMENSION_W (mm) |
4.5 |
| Minimum PACKAGE_DIMENSION_W (mm) |
4.3 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Maximum Seated_Plane_Height (mm) |
1.2 |
| Minimum Seated_Plane_Height (mm) |
N/A |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.1 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.63 |
| Terminal Thickness (mm) |
0.15 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
• Datacenter and enterprise computing
|
• Broadband fixed line access
|
| • Building automation |
| • Wired networking |
| • Motor drives |
|
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