|
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• Operating Range from 5.5 V to 28 V
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• One High−Side Driver for Mirror Heating; Iload = 6 A; RDS(on) = 100 m @ 25°C
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• Independent PWM Functionality for All Outputs
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• Integrated Programmable PWM Generator Unit for All Lamp Driver Outputs
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• Programmable Soft−start Function to Drive Loads with Higher
Inrush Currents as Current Limitation Value
|
• Multiplex Current Sense Analog Output for Advanced Load Monitoring
|
• Very Low Current Consumption in Standby Mode
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• Charge Pump Output to Control an External Reverse Polarity Protection MOSFET
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• 24−Bit SPI Interface for Output Control and Diagnostic
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• Protection Against Short−circuit, Overvoltage and Overtemperature
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• AEC−Q100 Qualified and PPAP Capable
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• SSOP36−EP Power Package
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• This is a Pb−Free Device
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|
| CATALOG |
NCV7707DQR2G LIFECYCLE
|
NCV7707DQR2G PARAMETRIC INFO
|
NCV7707DQR2G PACKAGE INFO
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NCV7707DQR2G MANUFACTURING INFO
|
NCV7707DQR2G PACKAGING INFO
|
NCV7707DQR2G ECAD MODELS
|
NCV7707DQR2G APPLICATIONS
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|
LIFECYCLE
|
Obsolete
Jan 31,2022
|
|
PARAMETRIC INFO
|
| Type |
Door Module Driver |
| Output Voltage (V) |
-0.3 to 40.3 |
| Maximum Operating Current (mA) |
20 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Automotive |
| Maximum On Resistance (Ohm) |
1.6(Typ) |
| Minimum Operating Supply Voltage (V) |
5.5 |
| Operating Supply Voltage (V) |
5.5 to 28 |
| Maximum Operating Supply Voltage (V) |
28 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Output Configuration |
H-Bridge |
| Control Interface |
PWM |
| Maximum Output Current (A) |
10 |
| Motor Type |
DC Motor |
|
|
PACKAGE INFO
|
| Supplier Package |
SSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
36 |
| Lead Shape |
Gull-wing |
| PCB |
36 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10.3 |
| Package Width (mm) |
7.5 |
| Package Height (mm) |
2.6(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.3 |
| Package Overall Width (mm) |
10.3 |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Shrink Small Outline Package Exposed Pad |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
|
|
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
| PACKAGING INFO |
| Packaging Suffix |
R2 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1500 |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • De−centralized Door Electronic Systems |
| • Body Control Units (BCUs) |
| |
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