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• Vout Adjustable up to 5.5V using FB pin
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• Wide 2.85V to 18V Operating Input Range
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• 12A Continuous/15A Peak Output Current
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• 1% Internal Reference Accuracy
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• I2C-Programmable Reference Range from 0.6V to 1.108V in 4mV Steps with Slew Rate Control
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• 5% Accuracy Output Voltage and Output Current Monitoring via I2C
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• Selectable PFM/PWM Mode, Adjustable Frequency and Current Limit through I2C
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• Four Different Selectable I2C Addresses
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• External Soft Start (SS)
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• Open-Drain Power Good (PG) Indication
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• Output Over-Voltage Protection (OVP)
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• Hiccup/Latch-Off Over-Current Protection (OCP)
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• Available in a QFN-14 (3mmx4mm) Package
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|
| CATALOG |
MP8869SGL-Z PARAMETRIC INFO
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MP8869SGL-Z PACKAGE INFO
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MP8869SGL-Z MANUFACTURING INFO
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MP8869SGL-Z PACKAGING INFO
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MP8869SGL-Z ECAD MODELS
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MP8869SGL-Z APPLICATIONS
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|
PARAMETRIC INFO
|
| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
2.85 |
| Maximum Input Voltage (V) |
18 |
| Output Voltage (V) |
0.6 to 5.5 |
| Maximum Output Current (A) |
12 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Frequency (kHz) |
500(Typ) |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
2.85 to 18 |
| Output Type |
Adjustable |
| Load Regulation |
3% |
| Typical Quiescent Current (uA) |
420 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
14 |
|
|
PACKAGE INFO
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| Supplier Package |
QFN |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
No Lead |
| PCB |
14 |
| Tab |
N/R |
| Package Length (mm) |
4.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Quad Flat No Lead Package |
| Package Family Name |
QFN |
| Jedec |
MO-220 |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • Solid-State Drives (SSD) |
| • Flat-Panel Televisions and Monitors |
| • Digital Set-Top Boxes |
| • Distributed Power Systems |
| • Networking/Servers |
| |
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