HomeBlogMMBD7000LT1G onsemi DIODE ARRAY GP 100V 200MA SOT23

MMBD7000LT1G onsemi DIODE ARRAY GP 100V 200MA SOT23

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January 9th, 2025 0
MMBD7000LT1G onsemi DIODE ARRAY GP 100V 200MA SOT23


• S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
CATALOG
MMBD7000LT1G PARAMETRIC INFO
MMBD7000LT1G PACKAGE INFO
MMBD7000LT1G MANUFACTURING INFO
MMBD7000LT1G PACKAGING INFO
MMBD7000LT1G ECAD MODELS


PARAMETRIC INFO
Type Small Signal Switching Diode
Configuration Dual Series
Maximum DC Reverse Voltage (V) 100
Maximum Continuous Forward Current (A) 0.2
Maximum Power Dissipation (mW) 300
Speed Ultra Fast Recovery Rectifier
Maximum Junction Ambient Thermal Resistance 556°C/W
Peak Forward Voltage (V) 1.1@0.1A
Peak Non-Repetitive Surge Current (A) 1.6
Peak Reverse Current (uA) 3
Peak Reverse Recovery Time (ns) 4
Operating Junction Temperature (°C) -55 to 150
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Maximum Diode Capacitance (pF) 1.5
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 3
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.3
Package Height (mm) 0.94
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.4
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-236AB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuFeNi
Shelf Life Period 24 Month
Shelf Life Condition 8°C to 30°C+30 % to 70 % RH
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T1
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Reel Width (mm) 8.4(Min)
Tape Pitch (mm) 4
Tape Width (mm) 8
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Single Pin At Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS

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