MGSF1N03LT1G AMI Semiconductor / ON Semiconductor MOSFET N-CH 30V 1.6A SOT-23

July 2th, 2026 62

• Low RDS(on) Provides Higher Efficiency and Extends Battery Life

• Miniature SOT-23 Surface Mount Package Saves Board Space

• MV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

• These Devices are Pb-Free and are RoHS Compliant

CATALOG

China

Czechia

Channel Type	N
Channel Mode	Enhancement
Configuration	Single
Maximum Drain-Source Voltage (V)	30
Maximum Continuous Drain Current (A)	2.1
Maximum Absolute Continuous Drain Current (A)	2.1
Maximum Gate-Source Voltage (V)	±20
Maximum Drain-Source Resistance (mOhm)	100@10V
Typical Gate Charge @ Vgs (nC)	3.2@10V
Breakdown Voltage Type	DSS
Operating Junction Temperature (°C)	-55 to 150
Typical Gate Charge @ 10V (nC)	3.2
Maximum Power Dissipation (mW)	690
Process Technology	0.8um to 3um
Minimum Gate Threshold Voltage (V)	1
Category	Power MOSFET
Typical Output Capacitance (pF)	100
Maximum Junction Ambient Thermal Resistance (°C/W)	400
Maximum Positive Gate-Source Voltage (V)	20
Typical Input Capacitance @ Vds (pF)	140@5V
Typical Gate Threshold Voltage (V)	1.7
Typical Reverse Transfer Capacitance @ Vds (pF)	40@5V
Typical Diode Forward Voltage (V)	0.8
Maximum Pulsed Drain Current @ TC=25°C (A)	6
Typical Turn-On Delay Time (ns)	2.5
Typical Turn-Off Delay Time (ns)	16
Typical Fall Time (ns)	8
Typical Rise Time (ns)	1
Maximum Gate-Source Leakage Current (nA)	100
Maximum Gate Threshold Voltage (V)	2.4
Maximum IDSS (uA)	1
Number of Elements per Chip	1
Minimum Storage Temperature (°C)	-55
Maximum Storage Temperature (°C)	150
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	150

Supplier Package	SOT-23
Basic Package Type	Lead-Frame SMT
Pin Count	3
Lead Shape	Gull-wing
PCB	3
Tab	N/R
Pin Pitch (mm)	0.95
Package Length (mm)	2.9
Package Width (mm)	1.3
Package Height (mm)	0.94
Package Diameter (mm)	N/R
Package Overall Length (mm)	2.9
Package Overall Width (mm)	2.4
Package Overall Height (mm)	1
Seated Plane Height (mm)	1
Mounting	Surface Mount
Terminal Width (mm)	0.44
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Small Outline Transistor
Package Family Name	SOT
Jedec	TO-236AB
Package Outline	Link to Datasheet
Maximum PACKAGE_DIMENSION_H (mm)	1.01
Minimum PACKAGE_DIMENSION_H (mm)	0.88
Maximum PACKAGE_DIMENSION_L (mm)	3.04
Minimum PACKAGE_DIMENSION_L (mm)	2.8
Maximum PACKAGE_DIMENSION_W (mm)	1.4
Minimum PACKAGE_DIMENSION_W (mm)	1.2
Maximum Diameter (mm)	N/R
Minimum Diameter (mm)	N/R
Maximum Seated_Plane_Height (mm)	1.11
Minimum Seated_Plane_Height (mm)	0.89

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	FeNi Alloy
Shelf Life Period	2 Years
Shelf Life Condition	8°C to 30°C+30 % to 70 % RH
Number of Wave Cycles	N/R

Packaging Suffix	T1
Packaging	Tape and Reel
Quantity Of Packaging	3000
Reel Diameter (in)	7
Reel Width (mm)	8.4(Min)
Tape Pitch (mm)	4
Tape Width (mm)	8
Feed Hole Pitch (mm)	4
Hole Center to Component Center (mm)	2
Component Orientation	Single Pin At Sprocket Hole
Packaging Document	Link to Datasheet
Tape Type	Embossed