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• Wide Operating Range: 2.9V to 5.5V, -40°C to +85°C
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| • 16-Pin SO Package (150 mils) |
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| CATALOG |
DS2482S-800+ COUNTRY OF ORIGIN
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DS2482S-800+ PARAMETRIC INFO
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DS2482S-800+ PACKAGE INFO
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DS2482S-800+ MANUFACTURING INFO
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DS2482S-800+ PACKAGING INFO
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DS2482S-800+ ECAD MODELS
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DS2482S-800+ APPLICATIONS
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COUNTRY OF ORIGIN
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| Thailand |
| United States of America |
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PARAMETRIC INFO
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| Maximum Operating Temperature (°C) |
85 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-55 |
| Temperature Flag |
Opr |
| Maximum Operating Supply Voltage (V) |
3.7|5.5 |
| Minimum Operating Supply Voltage (V) |
2.9|4.5 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Supply Current (mA) |
0.75 |
| Function |
Smart Interface Controller |
| Interface Type |
I2C |
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PACKAGE INFO
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| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
9.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.37 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.9 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
1.55 |
| Seated Plane Height (mm) |
1.55 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.42 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H (mm) |
1.5 |
| Minimum PACKAGE_DIMENSION_H (mm) |
1.25 |
| Maximum PACKAGE_DIMENSION_L (mm) |
10 |
| Minimum PACKAGE_DIMENSION_L (mm) |
9.8 |
| Maximum PACKAGE_DIMENSION_W (mm) |
4 |
| Minimum PACKAGE_DIMENSION_W (mm) |
3.8 |
| Maximum Diameter (mm) |
N/R |
| Minimum Diameter (mm) |
N/R |
| Maximum Seated_Plane_Height (mm) |
1.75 |
| Minimum Seated_Plane_Height (mm) |
1.35 |
| Ball Array Length (mm) |
N/R |
| Ball Array Width (mm) |
N/R |
| Stand-off Height (mm) |
0.18 |
| Number of Column Balls |
N/R |
| Number of Row Balls |
N/R |
| Terminal Length (mm) |
0.84 |
| Terminal Thickness (mm) |
0.22 |
| Bottom Pad Length (mm) |
N/R |
| Bottom Pad Width (mm) |
N/R |
| Bottom Pad Chamfer |
N/R |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu 194 |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
50 |
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ECAD MODELS
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| APPLICATIONS |
• Wireless Base Stations
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• Central Office Switches
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| • PBXs |
• Rack-Based Servers
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| • Medical Clinical Diagnostic Equipment |
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